KEMET’s KC-LINK with KONNEKT technology surface mount capacitors are designed for high-efficiency and high-density power applications. KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution for high density packaging. By utilizing KEMET’s robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.

KONNEKT technology enables a low-loss, low-inductance package capable of  handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. With an operating temperature range up to 150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. KC-LINK with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.

These capacitors can also be mounted in a low-loss orientation to further increase power handling capability. The low-loss orientation lowers Effective Series Resistance (ESR) and Effective Series Inductance (ESL) which increases ripple current handling capability.

KEMET’s U2J with KONNEKT surface mount capacitors are designed for high-efficiency and high-density power applications.

By utilizing ultrastable U2J dielectric, KONNEKT enables a low-loss, low inductance package capable of handling extremely high ripple currents in the hundreds of kilohertz.

U2J is an extremely stable Class I dielectric material that exhibits a negligible shift in capacitance with respect to voltage and a predictable and linear change in capacitance with reference to ambient temperature, with minimal aging effect.

Capacitance change is limited to –750 ±120 ppm/°C from –55°C to +125°C. U2J KONNEKT can also be mounted in a low-loss orientation to further increasing its power handling capability. The low-loss orientation lowers ESR (Effective Series Resistance) and ESL (Effective Series Inductance) which increases ripple current handling capability.

KEMET’s X7R with KONNEKT technology surface mount capacitors are designed for applications where higher capacitance and voltage are needed without requiring additional board space.

KEMET’s X7R dielectric features a 125°C maximum operating temperature and is considered temperature stable.

The Electronics Components, Assemblies and Materials Association (EIA) characterizes X7R dielectric as a Class II material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X7R exhibits a predictable change in capacitance with respect to time and voltage, boasting a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from −55°C to +125°C.

In addition to their use in power supplies, these capacitors can be used in industries related to automotive (hybrid), telecommunications, medical, military, aerospace, semiconductors and test/diagnostic equipment. Automotive Grade devices are also available which meet the demanding Automotive Electronics Council’s AEC-Q200 qualification requirements.

KEMET’s C0G with KONNEKT technology surface mount capacitors are designed for high-efficiency and high-density power applications. KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multichip solution for high density packaging. By utilizing KEMET’s robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.

With an operating temperature range up to 125°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. C0G with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.

C0G with KONNEKT series compliments the KC-LINK with KONNEKT series by offering a wider voltage range and operating temperature range up to 125°C.