- Manual process only for lab and prototype. Not recommended for production
- Solder iron temperature (< 300°C)
- SAC solder paste recommendations
- Preheating recommended to limit temperature gradient <XX °C/minimum. Placing the KONNEKT capacitor in an oven at 150°C immediately prior to the manual process can reduce risk of cracking
- Never touch the termination of a capacitor with solder iron
- Use recommended land patterns on KEMET datasheet
The preferred method of attachment for KEMET’s KONNEKT Capacitors is IR or convection reflow where temperature, time and air flow are well controlled.
However, it is understood that the manual attachment of KONNEKT capacitors is necessary for prototype and lab testing. In these instances, care must be taken not to introduce excessive temperature gradients in the KONNEKT part type that may lead to cracking in the ceramic or separation of the TLPS material.
The following methods of attachment and detachment are proposed based on successful demonstrations in our lab:
*The following methods are usable for both low-loss and traditional orientations.
Manual Attach using Solder Paste
- Attach the KONNEKT capacitor using dispensed solder paste and soldering iron.
- Dispense solder paste to appropriately cover solder pad. Using anti-static tweezers, place the KONNEKT capacitor on the land pattern.
- While gently holding the capacitor in place using tweezers, touch the soldering iron to one side of the solder pad so that the tip of the iron is touching the solder paste. Moving the tip of the iron from side to side on the pad can help with even heating of the solder.
- Once the solder paste has entered a liquidous state, move the tip of the iron close to the termination of the capacitor while trying to avoid direct contact with the termination. Moving the tip of the iron from side to side on the pad can help with even distribution of solder. Once a good fillet is formed, remove the soldering iron and repeat the process on the second termination.
- It is best to solder the second termination immediately after the first to take advantage of the pre-heated capacitor.
- Visually inspect both solder joints using a 10x magnifying eye loop for smooth consistent solder joints.