KEMET Net List Files

KEMET FIT Calculator Software

KEMET Spice Software

Version 3.9.56

KEMET Spice Software is freeware intended to aid design engineers in analyzing the performance of these capacitors over frequency, temperature, ripple, and DC bias conditions. The capacitor types include ceramic (MLCC), tantalum, polymer, and aluminum polymer capacitor types. Each capacitor type behaves differently to the conditions of the circuit, some showing no changes to moderate changes, while others showing very large changes to these conditions. Although it is a stand-alone, Windows-based program, it is able to create files that can be imported into some commercial versions of SPICE software. Setup/Installation File To set up the latest version of KEMET Spice on the targeted computer, you must use the setup program (20.5 MB) to load the required *.DLL and *.OCX files into the System32 directory. Because it will write these files to the System32 directory and write to the registry, you will need administrative rights to load the program successfully. The "Update" options are no longer offered as the setup file will uninstall the previous version of KEMET Spice before installing the latest version. A "Freeware" declaration is in PDF format, adjacent to the setup download program. The instructional manual ("Instructions for KEMET Spice 3.9.5x.pdf") details the operation of this software.		Note-Windows Vista Users You must right-click on the downloaded setup file and choose “Run as administrator” to install.

17-Apr-2012 Rev 3.9.5x

• Removed and voltage or size on window forms using period as decimal and made these dependent on local preferences (decimal as period or decimal as comma).
• Added T540 (COTS version of selected T520) and T541 (COTS version of selected T530).
• Added T522 (reduced leakage currents – Ta Poly) and T489 (reduced leakage currents – Ta MnO₂).
• Fixed problem with Cumulative Ripple Currents versus temperature rise for Ta MnO₂.
• Fixed problem for ceramics in converting PN to selected voltage.
• Installation using InstallShield in place of WiseInstall as WiseInstall was very outdated.
• Key Function <Ctrl><F1> changed to <Shift><I> - Plot Temp Rise vs. Ripple Current at Multiple Frequencies. (After new installation, ^F1 no longer worked.)
• Key Function <Ctrl><F9> changed to <Ctrl><Shift><I> - Plot Temp Rise vs. Cum. Ripple Currents from Multiple Frequencies. (Modified to be slight derivation of item detailed above.)
• Added Ansys and Multisim EDA model capabilities and model collections (zip).
• Added capability of creating Maximum/Minimum Impedance variations of plotted response utilizing ± tolerance listed for capacitance, and ±20% of the nominal ESR (<Ctrl><+>).
• Corrected MnO₂ ESR temperature compensation from polynomial reaching minimum at 100°C to reaching minimum at 125°C.
• Corrected R_th for C4AE four terminal devices (R_th is half previous allowing for 40% increase in ripple current).
• Using ripple voltage for C4AE obtained at 10 kHz, as maximum ripple voltage for all lower frequencies; to stay below partial discharge activation voltages.

13-Oct-2011 Rev 3.9.4

• Corrected Power Film RMS voltages based in rated voltage – error in 700 VDC.

26-July-2011 Rev 3.9.3

• Peak voltage for power film based on RMS voltage levels from catalog.

15-June-2011 Rev 3.9.2

• Removed “SendKeys” function and replaced as that function is no longer supported in Win7 API.
• Corrected mouse activated test descriptors for monitored labels and values during plots.

10-June-2011 Rev 3.9.1

• Corrected setup using ComDlg32.OCX, OleDlg.DLL, RichTx32.OCX, and TabCtl32.OCX from Windows/System32 instead of Windows/SysWOW64.
• Removed additional VAL() functions.
• Allowed changing piece multipliers during Combined Impedance plots.
• Fixed rarely activated errors involved with Multiple Piece, Multiple Temperature, and Multiple Bias plots.

31-May-2011 Rev 3.9.0

• Added Film Leaded Selection Form.
• Added C4AE four terminal boxed film.
• Added transitioning ESL (decreasing with increasing frequency) capability for all part type.
• Added polypropylene (PP) dielectric with capacitance and ESR temperature compensation.
• Added chip count in capacitance selection list to any stacked ceramic offering available with multiple chip offerings (e.g., KPS, L1R, L1C, etc.).
• Added C0G high temperature arrays as these were left off by oversight.
• Corrected Leadframe resistance in KPS from Ohms to milliohms.

Program Manual

Part List .XLS

KEMET Net List Files

Models

KEMET FIT Calculator Software

Version 3.5.31