KEMET NetList Files - Mentor
These models are created for Mentor Graphics PCB Design Software - HyprLynx Signal and Power Integrity software.
Link to Mentor Graphics web page:
These models are variations of the NetList subcircuit type files. This is different from previous offerings on this site as they were variations of Touchstone formatted impedance files. By creating subcircuit files in place of the impedance files, the size of the files is dramatically reduced. The file type designation for these files is 'SP' whereas the typical subcircuit file would be designated with the 'CKT' type file descriptor. In accordance with Mentor's request, the part number for the individual files is preceded by "KEMET_" (e.g., 'Kemet_C0805C104K5RAC").
The files are collected in groups and compressed in Zip files. The 1st group consists of the ceramic or MLCC part types “C0201-C0805” including C0201, C0402, C0603, and C0805 chip sizes, and the 2nd group "C1206-C2225" contains the chip sizes C1206, C1210, C1812, C1825, C2220, and C2225. The "Ceramic SMD Array" compression holds the CA04 or 1632 four-capacitor arrays, while the "KPS 1210-2220" contains model files for the KPS series of "J-Type" leadframe devices with single or dual chips. The "MIL DSCC" collection holds the MIL-C-PRF (CDR0 and CDR3) series of SMD capacitors as well as the DSCC 03028 and 03029 series. Each collection holds all dielectric types for each.
A typical file for a 0402 chip of X7R dielectric, with capacitance of 0.1 uF, and a voltage rating of 16 VDC, would be "KEMET_C0402C104K4RAC.SP" and its contents would be as shown below:
.SUBCKT C0402C104K4RAC 1 6
* Temp@ 25°C, Bias@ 0Vdc , Center Freq@ 1.000MHz
* KEMET Model RLC Cerm.JPG / Spice Version 3.7.1 L1 1 2 52.00E-12
L2 2 3 988.00E-12
R1 3 4 31.70E-03
C1 4 6 91.00E-09
R2 2 5 3.17
C2 5 6 2.80E-12
R3 1 6 10.000E+09
The aluminum polymer capacitor files are contained in a separate zip file. This file contains 121 part types, all with the prefix 'A700'.
The tantalum commercial SMD capacitors begin with these two compressed files: with MnO2 cathode systems include the T489 (lower Leakage), T491 (standard commercial) , and T494 (lower ESR limits), T495 (lower ESR by design), T496 (internal fuse protected), T497 (high reliability), T498 (150°C capable), T499 (175°C capable), T510 (ultra low ESR with multiple pellets).
Military versions of the Tantalum-MnO2 devices include T4x9 (CWR09, CWR19, and CWR29 CKT files), T492 (CWR11), and the T493 (COTS) series.
Tantalum with conductive-polymers (for lower ESR and non-ignition failures) include the capacitor types T520 (rated to +105°C), T521 (high voltage polymers >16 Vdc), T522 (lower Leakage), T525 (rated to +125°C), T528 (facedown for low ESL and higher ripple current), and T530 (ultra-low ESR using multiple pellets and conductive polymer rated to +125°C).
The most recent offerings of tantalum polymer are two groups for COTS applications. The T540 is a COTS version of the T525 and the T541 is a COTS version of the T530.
The last groups are for the surface-mount film capacitors. These are divided by dielectric types: PEN, PET, PPS, and Paper. The PEN are the polyethylene naphthalate with a temperature capability from -55°C to 150°C(125° is standard). These are characterized with dielectric constant of 3.0, minimum thickness of 1.4 um, typical dissipation factor of 0.4%, and a dielectric absorption rating of 1.2%. These include part types with series designations of GMC (potted SMD) , GMW (naked SMD film), and GPC (potted SMD). The LDE series are more common SMD in chips sizes from 1206 through 6052.
The PET are the polyester film capacitors with a temperature capability of -55°C to 125°C(100°C is standard). These are characterized with dielectric constant of 3.3, minimum thickness of 0.9 um, typical dissipation factor of 0.5%, and a dielectric absorption rating of 0.5%. These include part types with series designations of MMC (potted SMD) and MDC ("L" Type DIL with offset), MDK (insertion type DIL), and MDS ("L" type DIL with minimal offset) for the DIL surface mount packages.
The PPS are the polyethylene sulfide with a temperature capability from -55°C to 150°C(125° is standard). These are characterized with dielectric constant of 3.0, minimum thickness of 1.2 um, typical dissipation factor of 0.06%, and a dielectric absorption rating of 0.01%. These include part types with series designations of SPC (potted SMD) , SMC (potted SMD) , and SMW (naked SMD film). The LDB are multilayer stacked chips of more common SMD in chips sizes from 1206 through 1812.
The metalized Paper types are limited to the single series: SMP253. These are high-voltage capacitors explicitly designed for class Y2 EMI filtering. The voltage rating for these capacitors is 250 VAC, whereas all other capacitor types have their voltage ratings expressed as VDC (7 CKT files).
The following press release was created detailing the model import capability with Mentor Hyperlynx 8.9 software:
February 10, 2009
KEMET’S PRODUCT LIBRARY AND CAPACITOR MODELS ARE NOW AVAILABLE ON THE MENTOR HYPERLYNX 8.9 POWER INTEGRITY SIMULATION TOOL
Greenville, South Carolina (February 10, 2009) – KEMET Corporation (KEME.OB),
The Capacitance Company, announced that it has released its full line of capacitor models to the Mentor Graphics simulation software, which allows Signal Integrity, Power Integrity, and board design engineers to model the decoupling scheme of a printed circuit board using the Mentor HyperLynx 8.0 Power Integrity and HyperLynx Signal Integrity products. KEMET’s new low ESR and low ESL polymer products are specifically designed for the high speed processor board level decoupling applications.
Using the Mentor HyperLynx 8.0 Power Integrity simulation tool, design engineers will have the ability to model the time-domain and frequency behavior of Aluminum, Film, Ceramic, and Tantalum SMD capacitors manufactured by KEMET. This new resource will make it easier for the products of tomorrow to be designed using KEMET capacitors.
“KEMET’s goal is to ensure that our models are included and compatible with the most accepted, demanding, and accurate of the simulation tools available. We believe that with the inclusion with Mentor’s software, we have completed a major step towards that goal,” stated John D. Prymak, Director Advanced Applications, KEMET Electronics Corp. “Our focus continues to be on partnering with design engineers and helping to find the right capacitance solutions to accomplish their project’s specific need,” continued Prymak.
“We are pleased to work with KEMET to assure that our customers have access to their full line of capacitor models when using the HyperLynx 8.0 Power Integrity and HyperLynx Signal Integrity products. The biggest hurdle for analysis has always been accurate models and KEMET is on top of this with strong characterization of their parts, enabling engineers to quickly set up analysis to optimize their power distribution networks," stated Dave Kohlmeier, High-Speed Product Line Director, Mentor Graphics.