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| Created: 07/27/2004 |
Product: Ceramic |
| Updated: 11/09/2005 |
Category: Terminations
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What are the termination types on military ceramic chips? |
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Description :
What are the termination types on military ceramic chips?
Answer :
Military MLCC are available with either of two termination finishes. Our “Solderguard I” incorporates a Ni barrier layer to protect against leaching, with an over coating of Sn60 solder, applied by dipping. This termination meets the requirements of MIL-PRF-55681 “S” (solder coated, final), and “U” (base metallization – barrier metal – solder coated). For those customers requesting a plated termination, we offer “Solderguard II”, incorporating the same Ni barrier layer, which is then over-plated with pure matte Sn. This termination meets the current requirements of MIL-PRF-55681 “W” (base metallization – barrier metal – tinned or tin/lead alloy), or “Y” (base metallization – barrier metal – tinned – 100% Sn). In addition, we can supply gold plating over nickel, but this is considered a non-standard termination, and cannot be JAN branded.
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