Surface Mount Film Capacitor Selection Chart

Links to other resources in the printed catalogs

Series LDB, LDE
- Ordering info and general tech data is at the front of the
datasheet, soldering info. at the back.

Series MDx, MMC, Gxx, Sxx, SMP253
- Ordering info, pkg. qty, general tech data.
- Soldering, taping, component marking: MDx, all others.
- Component layout library for Innoveda's PowerLogic
and PowerPCB layout programs. (Zipped file.)

Series JSN (also see the datasheet)
- Ordering codes, box qty and other commercial & tech info.

Metallized Polyester

General purpose, especially if self healing is needed

DC Volt min/max	AC Volt min/max	Max. uF (min volt/ max volt)	Series	Max. Temp °C	Construction	Size Range	Peak solder temp °C	Comments
50 400	30 200	15 uF 0.47 uF	MMC	100	Encapsulated	2220 to 6560	240	Larger sizes may be vertically mounted to reduce footprint.
50 630	30 220	15 uF 0.18 uF	MDC	125	DIL (Dual In-Line)	3 to 8 leads per side	240	Ideal for filtering high frequency SMPS. Through-hole series MDK also available.
50 630	30 220	6.8 uF 0.1 uF	MDS	125	DIL (Dual In-Line)	3 to 8 leads per side	240	Low profile version of MDC. Ideal for filtering high frequency SMPS.
100 250	63 160	68 uF 15 uF	JSN	125	Stacked, SMD solder tabs	6080 to 60160	Please ask	Ideal for filtering & DC link in power devices. Custom designs available. Soldering should be discussed with a Kemet engineer as there are special considerations for large parts.

Metallized PEN, including high dV/dt version

Similar to polyester, more stable and higher solder temp.

DC Volt min/max	AC Volt min/max	Max. uF (min volt/ max volt)	Series	Max. Temp °C	Construction	Size Range	Peak solder temp °C	Comments
50 1000	40 250	4.7 uF 0.1 uF	LDE	125	Stacked unencapsulated	1206 to 6054	245-255	Solder temp depends on size. See the soldering info at the back of the datasheet.
50 630	30 300	5.6 uF 0.15 uF	GMC	125	Encapsulated	2220 to 6560	250	Larger sizes may be vertically mounted to reduce footprint.
63 630	40 220	0.47 uF 6.8 nF	GMW	125	Wound unencapsulated	2220	240	See the note about solder paste thickness in the soldering guidelines.
63 1000	40 350	1 uF 0.068 uF	GPC	125	Encapsulated	2824 to 6560	250	Double metallized construction for pulse applications. dV/dt to 2200V/uS. Larger sizes may be vertically mounted to reduce footprint.

Metallized PPS, including high dV/dt version

Near-C0G stability, highest operating and solder temp.

DC Volt min/max	AC Volt min/max	Max. uF (min volt/ max volt)	Series	Max. Temp °C	Construction	Size Range	Peak solder temp °C	>Comments
16 50		0.1 uF 0.1 uF	LDB	125	Stacked unencapsulated	1206-1812	260	Ideal for use in C0G applications where bending or thermal stress is an issue.
50 40	30 200	3.3 uF 0.22 uF	SMC	125*	Encapsulated	2220 to 6560	260	In application specific cases up to 175°C may be approved. Ask an engineer for details. Larger sizes may be vertically mounted to reduce footprint.
50 400	30 200	0.56 uF 0.022 uF	SMW	125	Wound unencapsulated	2220 to 2824	240	See the note about solder paste thickness in the soldering guidelines.
100 630	63 350	15 uF 0.18 uF	SPC	125*	Encapsulated	2824 to 6560	255	Double metallized construction for pulse applications. dV/dt to 2000V/uS. Low DF supports use with high freq. AC. In application specific cases up to 175°C may be approved. Ask an engineer for details. Larger sizes may be vertically mounted to reduce footprint.

Metallized Impregnated Paper - EMI Y2

Use when an SMD Y cap is preferred over through-hole

DC Volt min/max	AC Volt min/max	Max. uF (min volt/ max volt)	Series	Max. Temp °C	Construction	Size Range	Peak solder temp °C	Comments
	250	4.7 nF	SMP253	100	Encapsulated	5045	250	Safety agency rated Y2. Excellent self-healing. May be vertically mounted to reduce footprint.

See the complete line of safety agency approved EMI capacitors.

Service

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