Frequently Asked Questions

F1 Technology and Simulated Breakdown Screening

1. What is KEMET’s F1 Technology and what are the advantages?

KEMET’s F1 Technology package incorporates three process methodologies for improved anode quality. Two of these technologies aid in slowing the crystallization process that naturally occurs in the anode. By minimizing oxygen and carbon content in our anodes, we address two of the main contaminants that can lead to crystallization of the anode. The remaining technology provides a stronger mechanical connection point between the Ta lead wire and Ta anode, thus improving robustness and product reliability.

2. What is KEMET’s Simulated Breakdown Screening and what are the advantages?

This refers to a special patented screening technique which allows the identification of capacitors with hidden defects in the dielectric, without any damage to the general population of the capacitors. The screening is based on the simulation of breakdown voltage (BDV) without actually damaging the capacitors. The BDV test is an ultimate test of the dielectric in a capacitor. Low BDV indicates defects in the dielectric and, therefore, higher probability of failure in the field. High BDV indicates stronger dielectric and high-reliability performance in the field. This new screening method allows KEMET to identify the breakdown voltage of each individual capacitor so that we provide only the strongest capacitors from each lot.

3. What leadframe materials are available with these technologies?

Depending on part type ordered, the available termination finishes are: tin/lead (order with an “H” suffix), 100% tin (order with a “T” suffix), gold plated (order with a “G” suffix), solder fused (order with a “K” suffix), or hot solder dipped (order with a “C” suffix). Consult our catalog for options.

4. Is the physical appearance of these devices different?

These process additions do not alter the appearance of the devices. The devices will maintain the appearance and markings of the existing parent capacitor series (e.g. T493).

5. What packaging options are available?

This product is available in tape and reel packaging.

6. What is the lead time for this series?

Current lead time is two to three weeks over and above standard lead times.

7. What is product availability?

KEMET is offering our F1 technology currently on limited part types as indicated below (see full part list on next page):
T493 Series - select D and X case capacitance values in 20 V and higher rated voltage
T497 Series - select H case capacitance values in 20 V and higher rated voltage

KEMET is currently developing this capability on additional part types for future releases as well.

KEMET offers these technologies in the following arrangements: 1) F1 Technology alone, 2) Simulated Breakdown Screening alone, or 3) combination of both F1 and Simulated Breakdown Screening technologies. Please see associated Specification Sheet for available part types and ordering information.



Please contact KEMET tantalum product management for additional details on the ordering of these product reliability improvements.

KEMET Product Management Contacts:

Ed Jones Sandy Campbell Craig Scruggs

864-963-6333 864-963-6294 864-228-4178

edjones@kemet.com sandycampbell@kemet.com craigscruggs@kemet.com

8. What are the target markets for these technologies?

These new technologies are suitable for high-reliability applications in the military, aerospace, and medical industries.

9. Are there any special handling requirements?

These devices are MSL 1 (Moisture Sensitivity Level), and therefore require no moisture-controlled packaging. Moisture-controlled packaging is available per customer request. Once board mounted, there are no further restrictions on moisture exposure.