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KEMET NetList Files - Mentor

These models are created for Mentor Graphics PCB Design Software - HyprLynx Signal and Power Integrity software.
Link to Mentor Graphics web page: http://www.mentor.com/products/pcb-system-design/analysis-verification/hyperlynx-signal-integrity/

These models are variations of the NetList subcircuit type files. This is different from previous offerings on this site as they were variations of Touchstone formatted impedance files. By creating subcircuit files in place of the impedance files, the size of the files is dramatically reduced. The file type designation for these files is 'SP' whereas the typical subcircuit file would be designated with the 'CKT' type file descriptor. In accordance with Mentor's request, the part number for the individual files is preceded by "KEMET_" (e.g., 'Kemet_C0805C104K5RAC").

The files are collected in groups and compressed in Zip files. The 1st group consists of the ceramic or MLCC part types “C0201-C0805” including C0201, C0402, C0603, and C0805 chip sizes (980 PNs total), and the 2nd group "C1206-C2225" contains the chip sizes C1206, C1210, C1812, C1825, C2220, and C2225 (1,695 total PNs). The "Ceramic Array" compression holds 73 PNs, while the "KPS 1210-2220" contains model files for the KPS series (458 PNs) of "J-Type" leadframe devices with single or dual chips.

KEMET Ceramic Array CA0x.ZIPKEMET Ceramic MIL DSCC CDR.ZIPKEMET Ceramic KPS 1210-2220.ZIPKEMET Ceramic C1206-C2225.ZIPKEMET Ceramic C0201-C0805.ZIP



A typical file for a 0402 chip of X7R dielectric, with capacitance of 0.1 uF, and a voltage rating of 16 VDC, would be "KEMET_C0402C104K4RAC.SP" and its contents would be as shown below:

.SUBCKT C0402C104K4RAC 1 6
* Temp@ 25°C, Bias@ 0Vdc , Center Freq@ 1.000MHz
* KEMET Model RLC Cerm.JPG / Spice Version 3.7.1
L1 1 2 52.00E-12
L2 2 3 988.00E-12
R1 3 4 31.70E-03
C1 4 6 91.00E-09
R2 2 5 3.17
C2 5 6 2.80E-12
R3 1 6 10.000E+09
.ENDS

The aluminum polymer capacitor files are contained in a separate zip file. This file contains 121 part types, all with the prefix 'A700'.

KEMET Aluminum-Polymer A700.ZIP



The tantalum commercial SMD capacitors begin with these two compressed files: with MnO2 cathode systems include the T491 (371 PNs) , and T494 (371 PNs). The third compressed file separates the fused and high reliability series into another compression which includes 234 CKT files.

KEMET Tantalum HiRel T496 T497.ZIPKEMET Tantalum Comm T491.ZIPKEMET Tantalum Comm LowESR T494.ZIP



Specialty tantalum capacitors containing MnO2 cathode systems with reduced ESR by design and the T510 ultra-low ESR achieved with multiple anodes for even lower ESR. (395 files total)

KEMET Tantalum LowESR T495 T510.ZIP



High temperature series for 150°C applications (T498) as well as 175°C applications (T499) are includes in the next compression file. (149 files total)

KEMET Tantalum HiTemp T498 T499.ZIP



Military versions of the Tantalum-MnO2 devices include T492 (CWR11), and T493 (COTS) capacitor types (440 CKT files), and the T4x9 (CWR09, CWR19, and CWR29 CKT files). (337 files total)

KEMET Tantalum Military CWRx9 T4x9.zipKEMET Tantalum Military CWR11 T492 -COTS T493.zip




Tantalum with conductive-polymers (for lower ESR and non-ignition failures) include the capacitor types T520 (polymer rated to +105°C - 375 CKT files), The second compressed file contains 88 files for T521 (high voltage polymers >16 Vdc), T525 (rated to +125°C), and T528 (facedown for low ESL and higher ripple current). The third group contains 53 file for T530 (ultra-low ESR using multiple anodes and conductive polymer rated to +125°C).

KEMET Tantalum-Polymer - T530.ZIPKEMET Tantalum-Polymer - T521-528.ZIPKEMET Tantalum-Polymer - T520.ZIP



The last groups are for the surface-mount film capacitors. These are divided by dielectric types: PEN, PET, PPS, and Paper. The PEN are the polyethylene naphthalate with a temperature capability from -55°C to 150°C(125° is standard). These are characterized with dielectric constant of 3.0, minimum thickness of 1.4 um, typical dissipation factor of 0.4%, and a dielectric absorption rating of 1.2%. These include part types with series designations of GMC , GMW, and GPC containing 555 CKT files, and the LDE (only 2225 at this time) with 69 CKT files.

KEMET PEN FIlm LDE SMD.ZIPKEMET PEN FIlm GMC-GMW-GPC SMD.ZIP



The PET are the polyester film capacitors with a temperature capability of -55°C to 125°C(100°C is standard). These are characterized with dielectric constant of 3.3, minimum thickness of 0.9 um, typical dissipation factor of 0.5%, and a dielectric absorption rating of 0.5%. These include part types with series designations of MMC for the surface mount capacitor (335 CKT files) and MDC, MDK, and MDS for the DIL surface mount packages (673 CKT files).

KEMET PET Film MMC SMD.ZIPKEMET PET Film MDC-MDK-MDS DIL.ZIP



The PPS are the polyethylene sulfide with a temperature capability from -55°C to 150°C(125° is standard). These are characterized with dielectric constant of 3.0, minimum thickness of 1.2 um, typical dissipation factor of 0.06%, and a dielectric absorption rating of 0.01%. These include part types with series designations of SPC, SMC, and SMW (498 CKT files). The LDB are multilayer stacked chips of 1206, 1210, and 1812 chip sizes (35 CKT files).

KEMET PPS Film SPC-SMC-SMW SMD.ZIPKEMET PPS FIlm LDB SMD.ZIP



The metalized Paper types are limited to the single series: SMP253. These are high-voltage capacitors explicitly designed for class Y2 EMI filtering. The voltage rating for these capacitors is 250 VAC, whereas all other capacitor types have their voltage ratings expressed as VDC (7 CKT files).

KEMET Paper SMP253.ZIP



The following press release was created detailing the model import capability with Mentor Hyperlynx 8.9 software:

February 10, 2009
KEMET’S PRODUCT LIBRARY AND CAPACITOR MODELS ARE NOW AVAILABLE ON THE MENTOR HYPERLYNX 8.9 POWER INTEGRITY SIMULATION TOOL

Greenville, South Carolina (February 10, 2009) – KEMET Corporation (KEME.OB), The Capacitance Company, announced that it has released its full line of capacitor models to the Mentor Graphics simulation software, which allows Signal Integrity, Power Integrity, and board design engineers to model the decoupling scheme of a printed circuit board using the Mentor HyperLynx 8.0 Power Integrity and HyperLynx Signal Integrity products. KEMET’s new low ESR and low ESL polymer products are specifically designed for the high speed processor board level decoupling applications.

Using the Mentor HyperLynx 8.0 Power Integrity simulation tool, design engineers will have the ability to model the time-domain and frequency behavior of Aluminum, Film, Ceramic, and Tantalum SMD capacitors manufactured by KEMET. This new resource will make it easier for the products of tomorrow to be designed using KEMET capacitors.

“KEMET’s goal is to ensure that our models are included and compatible with the most accepted, demanding, and accurate of the simulation tools available. We believe that with the inclusion with Mentor’s software, we have completed a major step towards that goal,” stated John D. Prymak, Director Advanced Applications, KEMET Electronics Corp. “Our focus continues to be on partnering with design engineers and helping to find the right capacitance solutions to accomplish their project’s specific need,” continued Prymak.

“We are pleased to work with KEMET to assure that our customers have access to their full line of capacitor models when using the HyperLynx 8.0 Power Integrity and HyperLynx Signal Integrity products. The biggest hurdle for analysis has always been accurate models and KEMET is on top of this with strong characterization of their parts, enabling engineers to quickly set up analysis to optimize their power distribution networks," stated Dave Kohlmeier, High-Speed Product Line Director, Mentor Graphics.

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