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Catalog(s)
SelectDescriptionNumber
GR500 High Reliability Solid Tantalum CatalogF-2956
GR900/Mil-C-123 High Reliability Ceramic CatalogF-3054
Product Selection GuideF-3095
Tantalum Leaded CatalogF-3100
Ceramic Leaded CatalogF-3101
Surface Mount CatalogF-3102
Wet Tantalum CatalogF-3103
High Temp & High Voltage Ceramic CapacitorsF-3106
High Temperature High Voltage Product Selection GuideF-3108
Low Profile Tantalum SMT CatalogF-3109
Surface Mount Ferrite ProductsF-3115
General Notes
SelectDescriptionNumber
Power Dissipation C052/CK05F-2013
KEMET Part Numbering GuideF-2097
Mechanical Strength Properties Multilayer Ceramic ChipsF-2106
Mechanical Behavior of Ceramic CapacitorsF-2107
Influence of Termination Properties-Surface Mount CapacitorsF-2108
Capacitance Monitoring While Flex TestingF-2110
What Is a Capacitor?F-2856
Pitfalls of Inspection of Ceramic CapacitorsF-2880
Military QPL Approval SummaryF-3067
Ceramic Chip Manufacturers Cross ReferenceF-3068
Tantalum Chip Manufacturers Cross ReferenceF-3075
Tantalum Leaded Manufacturer's Cross ReferenceF-3219
Wet Tantalum Manufacturers Cross ReferenceF-3264
Board Assembly Notes
SelectDescriptionNumber
Surface Mount - Mounting Pad Dimensions & ConsiderationsF-2100
Reflow Soldering Process Considerations For Surface Mount ApplicationF-2102
Repair/Touch Up/Hand Solder - Can These Be Controlled?F-2103
Another Look - Wave Solder Process For Surface Mount ApplicationF-2105
Ceramic Chip Capacitors "Flex Cracks" Understanding & SolutionsF-2111
Electrical Characteristics
SelectDescriptionNumber
Solid Tantalum Capacitor Failure Mechanism and Determination of Failure RatesF-2695
Effects of High Current Transients on Solid Tantalum CapacitorsF-2794
Weibull Calculated Failure Rates for Mil-C-39003 Rev. H Solid Tantalum CapacitorsF-3050
Tech Topics Publications
SelectDescriptionNumber
Termination Materials Effect on Thermal Robustness3/91
Fail-Open Solid Tantalum Capacitors4/91
Wet vs. Dry Multilayer Ceramic Capacitor Manufacturing Processes8/91
Mechanical Properties of Ceramic Capacitors9/91
Molded Tantalum Chips - Capacitance Range Extensions11/91
Dielectrics Beyond Barium Titanate1/92
HAST (Highly Accelerated Stress Testing)3/92
Factors Differentiating Tantalum & Ceramic Chip Capacitors with Similar Capacitance Values5/92
Electrode Materials for Multilayer Ceramic Capacitors7/92
The Performance of KEMET Surface Mount Tantalum Chip Capacitors in High Ripple and Inrush Current Applications2/93
Stress Reduction Improves the Thermal Robustness of KEMET Ceramic Chips3/93
Moisture Barrier for Tantalum Chips5/93
Challenges in the Continuing Miniaturization of Surface Mount Resistors and Capacitors6/93
The T495 - Low ESR, Surge Tantalum Surface Mount Capacitor8/93
Flex or Bend Testing9/93
The Physics of Leakage Failures in Solid Tantalum Capacitors10/93
Some Electrical Characteristics of Thin Dielectric (Low Voltage) MLCs2/94
SPICE Models of Capacitors9/94
Flex Testing II10/94
Scintillation Testing of Tantalum Capacitors11/94
A Surge Step Stress Test for Tantalum Capacitors3/95
ESD Withstand Capability of MLCs6/95
Bulk Cassette for 0402 and 06039/96
Challenges in Manufacturing 0402 Multilayer Ceramic Capacitors11/96
IR Reflow Preconditioning3/97
Electrode Development6/97
Ultra-Low ESR Tantalum Chip Capacitor9/97
Base Metal Electrode (BME) Multilayer Ceramic Capacitors11/97
New SPICE Models7/98

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Technical Papers featured at CARTS 2010:

Click here for a full listing of our Technical Papers
  High Cap Stacked MLCCs for Power Supplies
 
  Can ESR Be Too Low
 
 
Spice Models with Temperature-Bias-Frequency Concerns
 
  Electrolyte Development for High Temp Alum-Electrolytic Capacitors
 
 
Performance and Reliability of High Voltage Polymer T521
 
     

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