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​​​​Customer Change Notification​​​​​

 

Lead Material Termination Ni/Pd/Au​ for "T" Case T520 Series Polymer Tantalum

Date:
August 22, 2014
ID Number (MMDDYY): PCN-22082014-CMC
Affected ProductsThis PCN affects the T520 Series Polymer Tantalum 100 µF, 6.3 V with case size EIA3528-12 (denomination "T" case size):
T520 table_1.png
Change KEMET has extended the qualification of the lead material (termination P – Ni/Pd/Au) used on T528 Series Facedown Terminal Polymer Tantalum since 2012, to the specific part type T520 Series Polymer Tantalum 100 µF, 6.3 V case size 3528-12.

A qualification package and/or samples are available upon request.  
Effective Date & Identification The effective change date for the new lead material is January 1st, 2015. The 100% Tin lead material products will be shipped until all stock is depleted.
ContactCristina Mota Caetano
Tantalum Technical Product Marketing Director
KEMET Electronics Corporation (www.kemet.com)
Tel: +351 96 330 84 59
E-Mail: cristinacaetano@kemet.com



Lead Material Termination Change
    (No impact on Soldering Process)


 
The change has no impact in the soldering process and can be visually identify in Picture I and II. 
Before, Ni under plating ​ 100% Tin plated: 

​​
Tin Termin.png 

Picture I. 100% Tin Termination​






After, Ni under plating
 –​ Pd/Au termination:


Pd_Au termin.png 

 
Picture II. 100% Pd/Au Termination

 

 

 
The lead material change requires an update in the part number described below:
Before: T520T107M006ATE070 and After: T520T107M006APE070